After disclosing high-level details of its new Tiger Lake CPU architecture, based on the ‘Willow Cove' core design and new Xe-LP integrated graphics last month, Intel has now officially taken the wraps off the actual chips in its 11th Gen Core lineup. There are 9 CPUs in total, across the Core i3, Core i5, and Core i7 families, and all are aimed at thin and light laptops.
The company also unveiled a new corporate identity with a redesigned logo and geometric motif, as well as its new Intel Evo branding for the Project Athena initiative that aims to deliver a high level of quality control when it comes to experiences across productivity, gaming, and entertainment.
Described as the “world's best processor for thin and light laptops”, the 11th Gen Core family will be available in more than 50 different laptops from Dell, Acer, Lenovo, HP, Samsung, Asus, and others that are expected to go on sale in many parts of the world this holiday season, and over 150 models in total.
Intel Executive Vice President and GM, Client Computing Group, Gregory Bryant, said during a virtual launch event that Tiger Lake “is the best processor Intel has ever built, the best processor on the market, and it certainly rises above all the imitators”.
There are two classes of new CPUs, UP3 (formerly the U-series) running at 15W and UP4 (formerly the Y-series) running at 7W, although Intel now uses a naming scheme that does not emphasize this difference. Laptop OEMs may also configure the TDP wattages as per the requirements of individual designs. The former can now run between 12W and 28W, while the latter can scale from 7W to 15W.
Starting at the top end, the Core i7-1185G7 has four cores with Hyper-Threading and runs at a base frequency of 3GHz with all-core and single-core boost speeds of up to 4.3GHz and 4.8GHz respectively. This model features Intel Iris Xe graphics with 96 execution units. In total, there are three Core i7, two Core i5, and four Core i3 models across the two TDP groups. The Core i3 models use Intel's older UHD graphics hardware and have only two cores with Hyper-Threading.
The 11th Gen Core ‘Tiger Lake' family promises 2.7X faster performance than the competition in specific creator usages, such as upscaling photos, which use Intel's DL Boost extensions and integrated AI processing hardware. Built-in AI can also be used to improve collaboration, for example applying background blur and noise removal in video conferencing software at lower power than before.
Intel claims the new integrated Iris Xe GPU will make Tiger Lake-based laptops better than 90 percent of thin and light models with discrete graphics sold last year, and that users can expect up to 2X higher frame rates in demanding games at 1080p. Based on the Xe-LP architecture, this could give Intel a significant boost in an area where it has so far lagged behind competitor AMD. Intel says laptop OEMs will be able to offer reasonable gaming quality in compact laptops that aren't designed to accommodate discrete GPUs.
On the platform level, Tiger Lake introduces support for Wi-Fi 6, USB 4, and Thunderbolt 4, as well as the internal PCIe 4.0, interconnect, and a new generation of DDR5 RAM. Direct connections to PCIe 4.0 SSDs will improve data transfer rates, and Thunderbolt 4 will allow for four 4K HDR displays to run simultaneously. Dolby Vision and the AV1 codec improve media performance, while total memory encryption should improve resilience to hardware-based security attacks.
This family of 11th Gen Core CPUs is manufactured on Intel's 10nm ‘SuperFin' process, which leverages improved transistor gates to reduce power leakage and increase performance at lower voltages. This improves power efficiency as well as the range of frequencies that Tiger Lake CPUs can achieve in compact laptops.
Intel struggled for several years to ship its first 10nm processors, the ill-fated Cannonlake generation, although it did manage to ship the subsequent Ice Lake generation in enough quantity in 2019 to serve some segments of the laptop market. Intel recently announced that its next step, down to 7nm, has also been delayed for at least a year, so the improvements delivered by the 10nm SuperFin process are much needed.
Intel 11th Gen Core i7 Key Specs
Essentials
|
|
Product
Collection
|
11th
Generation Intel® Core™ i7 Processors
|
Code
Name
|
Products
formerly Tiger Lake
|
Vertical
Segment
|
Mobile
|
Processor
Number
|
i7-1185G7
|
Status
|
Launched
|
Launch
Date
|
Q3'20
|
Lithography
|
10 nm
SuperFin
|
Recommended
Customer Price
|
$426.00
|
CPU
Specifications
|
|
# of
Cores
|
4
|
# of
Threads
|
8
|
Max
Turbo Frequency
|
4.80
GHz
|
Cache
|
12 MB
Intel® Smart Cache
|
Bus
Speed
|
4
GT/s
|
Configurable
TDP-up Frequency
|
3.00
GHz
|
Configurable
TDP-up
|
28 W
|
Configurable
TDP-down Frequency
|
1.20
GHz
|
Configurable
TDP-down
|
12 W
|
Supplemental
Information
|
|
Embedded
Options Available
|
No
|
Memory
Specifications
|
|
Max
Memory Size (dependent on memory type)
|
64 GB
|
Memory
Types
|
DDR4-3200,
LPDDR4x-4267
|
Max #
of Memory Channels
|
2
|
ECC
Memory Supported ‡
|
No
|
Processor
Graphics
|
|
Processor
Graphics ‡
|
Intel®
Iris® Xe Graphics
|
Graphics
Max Dynamic Frequency
|
1.35
GHz
|
Graphics
Output
|
eDP
1.4b, MIPI-DSI 2.0, DP 1.4, HDMI 2.0b
|
Execution
Units
|
96
|
Max
Resolution (HDMI)‡
|
4096x2304@60Hz
|
Max
Resolution (DP)‡
|
7680x4320@60Hz
|
Max
Resolution (eDP - Integrated Flat Panel)‡
|
4096x2304@60Hz
|
DirectX*
Support
|
12.1
|
OpenGL*
Support
|
4.6
|
Intel®
Quick Sync Video
|
Yes
|
Intel®
Clear Video HD Technology
|
Yes
|
# of
Displays Supported ‡
|
4
|
Device
ID
|
0x9A49
|
OpenCL*
Support
|
2
|
Expansion
Options
|
|
Intel®
Thunderbolt™ 4
|
Yes
|
Microprocessor
PCIe Revision
|
Gen 4
|
Chipset
/ PCH PCIe Revision
|
Gen 3
|
Package
Specifications
|
|
Max
CPU Configuration
|
1
|
TJUNCTION
|
100C
|
Package
Size
|
46.5x25
|
Advanced
Technologies
|
|
Intel®
Deep Learning Boost (Intel® DL Boost)
|
Yes
|
Intel®
Optane™ Memory Supported ‡
|
Yes
|
Intel®
Speed Shift Technology
|
Yes
|
Intel®
Turbo Boost Technology ‡
|
2
|
Intel
vPro® Platform Eligibility ‡
|
No
|
Intel®
Hyper-Threading Technology ‡
|
Yes
|
Intel®
Virtualization Technology (VT-x) ‡
|
Yes
|
Intel®
Virtualization Technology for Directed I/O (VT-d) ‡
|
Yes
|
Intel®
VT-x with Extended Page Tables (EPT) ‡
|
Yes
|
Instruction
Set
|
64-bit
|
Instruction
Set Extensions
|
Intel®
SSE4.1, Intel® SSE4.2, Intel® AVX2, Intel® AVX-512
|
Idle
States
|
Yes
|
Thermal
Monitoring Technologies
|
Yes
|
Intel®
Stable Image Platform Program (SIPP)
|
No
|
Intel®
Volume Management Device (VMD)
|
Yes
|
Intel®
Gaussian and Neural Accelerator 2.0
|
Yes
|
Intel®
Image Processing Unit
|
6
|
Intel®
Smart Sound Technology
|
Yes
|
Intel®
Wake on Voice
|
Yes
|
Intel®
High Definition Audio
|
Yes
|
MIPI
SoundWire*
|
1.1
|
Intel®
Adaptix™ Technology
|
Yes
|
Security
& Reliability
|
|
Intel®
AES New Instructions
|
Yes
|
Intel®
Software Guard Extensions (Intel® SGX)
|
No
|
Intel®
Trusted Execution Technology ‡
|
No
|
Intel®
OS Guard
|
Yes
|
Intel®
Boot Guard
|
Yes
|
Mode-based
Execute Control (MBE)
|
Yes
|
Intel®
Control-Flow Enforcement Technology
|
Yes
|
Intel®
Total Memory Encryption
|
No
|
Intel 11th Gen Core i7 Details
Processor Number
The Intel processor number is just one of several factors—along with processor brand, system configurations, and system-level benchmarks—to be considered when choosing the right processor for your computing needs. Read more about interpreting Intel® processor numbers or Intel® processor numbers for the Data Center.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Recommended Customer Price
Recommended Customer Price (RCP) is pricing guidance only for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice. Prices may vary for other package types and shipment quantities. If sold in bulk, the price represents individual units. Listing of RCP does not constitute a formal pricing offer from Intel. RCP values can vary due to tariffs.
Number of Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
Number of Threads
A Thread, or thread of execution, is a software term for the basic ordered sequence of instructions that can be passed through or processed by a single CPU core.
Max Turbo Frequency
Max turbo frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Cache
CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
Bus Speed
A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.
Configurable TDP-up Frequency
Configurable TDP-up Frequency is a processor operating mode where the processor behavior and performance are modified by raising TDP and the processor frequency to fixed points. The Configurable TDP-up Frequency is where the Configurable TDP-up is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Configurable TDP-up
Configurable TDP-up is a processor operating mode where the processor behavior and performance are modified by raising TDP and the processor frequency to fixed points. The use of Configurable TDP-up is typically executed by the system manufacturer to optimize power and performance. Configurable TDP-up is the average power, in watts, that the processor dissipates when operating at the Configurable TDP-up frequency under an Intel-defined, high-complexity workload.
Configurable TDP-down Frequency
Configurable TDP-down Frequency is a processor operating mode where the processor behavior and performance are modified by lowering TDP and the processor frequency to fixed points. The Configurable TDP-down Frequency is where the Configurable TDP-down is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Configurable TDP-down
Configurable TDP-down is a processor operating mode where the processor behavior and performance are modified by lowering TDP and the processor frequency to fixed points. The use of a Configurable TDP-down is typically executed by the system manufacturer to optimize power and performance. Configurable TDP-down is the average power, in watts, that the processor dissipates when operating at the Configurable TDP-down frequency under an Intel-defined, high-complexity workload.
Embedded Options Available
Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.
Max Memory Size
Max memory size refers to the maximum memory capacity supported by the processor.
Memory Types
Intel® processors come in four different types: a Single Channel, Dual Channel, Triple Channel, and Flex Mode.
Max Number of Memory Channels
The number of memory channels refers to the bandwidth operation for real-world applications.
ECC Memory Supported
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
Processor Graphics
Processor Graphics indicates graphics processing circuitry integrated into the processor, providing the graphics, compute, media, and display capabilities. Intel® HD Graphics, Iris™ Graphics, Iris Plus Graphics, and Iris Pro Graphics deliver enhanced media conversion, fast frame rates, and 4K Ultra HD (UHD) video. See the Intel® Graphics Technology page for more information.
Graphics Max Dynamic Frequency
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
Graphics Output
Graphics Output defines the interfaces available to communicate with display devices.
Execution Units
The Execution Unit is the foundational building block of Intel’s graphics architecture. Execution Units are computed processors optimized for simultaneous Multi-Threading for high throughput compute power.
Max Resolution (HDMI)
Max Resolution (HDMI) is the maximum resolution supported by the processor via the HDMI interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.
Max Resolution (DP)
Max Resolution (DP) is the maximum resolution supported by the processor via the DP interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.
Max Resolution
Max Resolution (Integrated Flat Panel) is the maximum resolution supported by the processor for a device with an integrated flat panel (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your device.
DirectX* Support
DirectX* Support indicates support for a specific version of Microsoft’s collection of APIs (Application Programming Interfaces) for handling multimedia compute tasks.
OpenGL* Support
OpenGL (Open Graphics Library) is a cross-language, multi-platform API (Application Programming Interface) for rendering 2D and 3D vector graphics.
Intel® Quick Sync Video
Intel® Quick Sync Video delivers fast conversion of video for portable media players, online sharing, and video editing and authoring.
Intel 11th Gen Core i7 Clear Video HD Technology
Intel® Clear Video HD Technology, like its predecessor, Intel® Clear Video Technology, is a suite of image decode and processing technologies built into the integrated processor graphics that improve video playback, delivering cleaner, sharper images, more natural, accurate, and vivid colors, and a clear and stable video picture. Intel® Clear Video HD Technology adds video quality enhancements for richer color and more realistic skin tones.
OpenCL* Support
OpenCL (Open Computing Language) is a multi-platform API (Application Programming Interface) for heterogeneous parallel programming.
Intel 11th Gen Core i7 Thunderbolt™ 4
Universal computer port that can dynamically adjust data and video bandwidth depending on the device and/or application.
Microprocessor PCIe Revision
Microprocessor PCIe Revision is the version supported by the processor for the PCIe lanes directly attached to the microprocessor. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCIe Express version support different data rates.
Chipset / PCH PCIe Revision
Chipset/PCH PCIe Revision is the version supported by the PCH for the PCIe lanes directly attached to the PCH. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCIe Express version support different data rates.
JUNCTION
Junction Temperature is the maximum temperature allowed at the processor die. Intel 11th Gen Core i7 Deep Learning Boost (Intel® DL Boost)
A new set of embedded processor technologies designed to accelerate AI deep learning use cases. It extends Intel AVX-512 with a new Vector Neural Network Instruction (VNNI) that significantly increases deep learning inference performance over previous generations.
Intel 11th Gen Core i7 Optane™ Memory Supported
Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements.
Intel 11th Gen Core i7 Speed Shift Technology
Intel® Speed Shift Technology uses hardware-controlled P-states to deliver dramatically quicker responsiveness with single-threaded, transient (short duration) workloads, such as web browsing, by allowing the processor to more quickly select its best-operating frequency and voltage for optimal performance and power efficiency.
Intel 11th Gen Core i7 Turbo Boost Technology
Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.
Intel 11th Gen Core i7 Platform Eligibility
The Intel vPro® platform is a set of hardware and technologies used to build business computing endpoints with premium performance, built-in security, modern manageability, and platform stability.
Intel 11th Gen Core i7 Hyper-Threading Technology
Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.
Intel 11th Gen Core i7 Virtualization Technology
Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.
Intel 11th Gen Core i7 Virtualization Technology for Directed I/O (VT-d)
Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve the security and reliability of the systems and also improve the performance of I/O devices in virtualized environments.
Intel® VT-x with Extended Page Tables
Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduce the memory and power overhead costs and increases battery life through hardware optimization of page table management.
Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Intel 11th Gen Core i7 Instruction Set Extensions
Instruction Set Extensions are additional instructions that can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).
Intel 11th Gen Core i7 Idle States
Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.
Intel 11th Gen Core i7 Thermal Monitoring Technologies
Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.
Intel 11th Gen Core i7 Stable Image Platform Program
The Intel® Stable Image Platform Program (Intel® SIPP) aims for zero changes to key platform components and drivers for at least 15 months or until the next generational release, reducing complexity for IT to effectively manage their computing endpoints.
Intel® Volume Management Device
Intel® Volume Management Device (VMD) provides a common, robust method of hotplug and LED management for NVMe-based solid-state drives.
Intel® Gaussian and Neural Accelerator 2.0
When power and performance are critical, the Intel® Gaussian & Neural Accelerator (Intel® GNA) provides power-efficient, always-on support. Intel® GNA is designed to deliver AI speech and audio applications such as neural noise cancellation, while simultaneously freeing up CPU resources for overall system performance and responsiveness.
Intel® Image Processing Unit
Intel® Image Processing Unit is an integrated image signal processor with advanced hardware implementation that improves image and video quality of cameras.
Intel® Smart Sound Technology
Intel® Smart Sound Technology is an integrated audio DSP (Digital Signal Processor) built to handle audio, voice, and speech interaction. It allows the latest Intel® Core™ processor-based PCs to respond to your voice command quickly and offer high fidelity audio without impact system performance and battery life.
Intel® Wake on Voice
Intel® Wake on Voice allows your device to wait and listen for your command without consuming excessive power and battery life, as well as the wake from modern standby.
Intel® High Definition Audio
Audio interface for codecs to communicate with Intel SoCs and chipsets.
MIPI SoundWire
SoundWire* interface is used by Audio Codecs to communicate with Intel SoCs and chipsets.
Intel® Adaptix™ Technology
Intel® Adaptix™ Technology is a collection of software tools used to tune the system for maximum performance and customize advanced system settings for such things as overclocking and graphics. These software tools help the system adapt these settings to its environment, utilizing machine learning algorithms and advanced power control settings.
Intel® AES New Instructions
Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI is valuable for a wide range of cryptographic applications, for example, applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.
Intel® Software Guard Extensions (Intel® SGX)
Intel® Software Guard Extensions (Intel® SGX) provide applications the ability to create hardware enforced trusted execution protection for their applications’ sensitive routines and data. Intel® SGX provides developers a way to partition their code and data into CPU hardened trusted execution environments (TEE’s).
Intel 11th Gen Core i7 Trusted Execution Technology
Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.
Intel 11th Gen Core i7 Boot Guard
Intel® Device Protection Technology with Boot Guard helps protect the system’s pre-OS environment from viruses and malicious software attacks.
Mode-based Execute Control
Mode-based Execute Control can more reliably verify and enforce the integrity of kernel-level code.
Intel 11th Gen Core i7 Control-Flow Enforcement Technology
CET - Intel Control-flow Enforcement Technology (CET) helps protect against the misuse of legitimate code snippets through return-oriented programming (ROP) control-flow hijacking attacks.
Intel 11th Gen Core i7 Total Memory Encryption
TME – Total Memory Encryption (TME) helps protect data against exposure via a physical attack on memory, such as cold-boot attacks.
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